MLchartDataset catalogue

Molding

Term · Semiconductors · MLC-T-SEM-000219

The process of encapsulating a semiconductor die and its interconnections within a protective material, typically epoxy resin, to form the final package body. This step provides mechanical protection against physical damage, environmental protection against moisture and contaminants, and thermal dissipation. Transfer molding is a common technique used for high-volume production.

Table 1. Record
IdentifierMLC-T-SEM-000219
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000219",
  "term": "Molding",
  "field": "Semiconductors",
  "definition": "The process of encapsulating a semiconductor die and its interconnections within a protective material, typically epoxy resin, to form the final package body. This step provides mechanical protection against physical damage, environmental protection against moisture and contaminants, and thermal dissipation. Transfer molding is a common technique used for high-volume production.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/molding/"
}

Record 224 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.