MLchartDataset catalogue

Backgrinding

Term · Semiconductors · MLC-T-SEM-000035

A mechanical process that reduces the thickness of a semiconductor wafer after the front-end fabrication steps are complete. This thinning is necessary to achieve smaller device form factors and improve thermal dissipation in integrated circuits. Wafers are typically ground to thicknesses ranging from 50 to 300 micrometers depending on the application.

Table 1. Record
IdentifierMLC-T-SEM-000035
FieldSemiconductors
SubjectMaterials & Wafers
Record as JSON 
{
  "id": "MLC-T-SEM-000035",
  "term": "Backgrinding",
  "field": "Semiconductors",
  "definition": "A mechanical process that reduces the thickness of a semiconductor wafer after the front-end fabrication steps are complete. This thinning is necessary to achieve smaller device form factors and improve thermal dissipation in integrated circuits. Wafers are typically ground to thicknesses ranging from 50 to 300 micrometers depending on the application.",
  "subject": "Materials & Wafers",
  "url": "https://mlchart.com/terminology/semiconductors/backgrinding/"
}

Record 27 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.