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Chemical mechanical planarisation

Term · Semiconductors · MLC-T-SEM-000056

A manufacturing process that combines chemical etching with mechanical abrasion to achieve a smooth, flat surface on semiconductor wafers. It uses a rotating platen, a polishing pad, and a chemical slurry to remove excess material and reduce topography. This technique is applied multiple times during integrated circuit fabrication to create a planar surface for subsequent lithography steps.

Table 1. Record
IdentifierMLC-T-SEM-000056
FieldSemiconductors
SubjectDeposition, Etch & Clean
AbbreviationCMP
Record as JSON 
{
  "id": "MLC-T-SEM-000056",
  "term": "Chemical mechanical planarisation",
  "field": "Semiconductors",
  "definition": "A manufacturing process that combines chemical etching with mechanical abrasion to achieve a smooth, flat surface on semiconductor wafers. It uses a rotating platen, a polishing pad, and a chemical slurry to remove excess material and reduce topography. This technique is applied multiple times during integrated circuit fabrication to create a planar surface for subsequent lithography steps.",
  "abbreviation": "CMP",
  "subject": "Deposition, Etch & Clean",
  "url": "https://mlchart.com/terminology/semiconductors/chemical-mechanical-planarisation/"
}

Record 48 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.