MLchartDataset catalogue

Slurry

Term · Semiconductors · MLC-T-SEM-000312

A suspension of abrasive particles in a liquid medium, used in chemical mechanical planarization (CMP) to polish and planarize semiconductor wafers. The slurry contains both abrasive particles, such as silica or alumina, and chemical agents that react with the wafer surface. The chemical and mechanical actions work synergistically to achieve material removal and surface flattening.

Table 1. Record
IdentifierMLC-T-SEM-000312
FieldSemiconductors
SubjectDeposition, Etch & Clean
Record as JSON 
{
  "id": "MLC-T-SEM-000312",
  "term": "Slurry",
  "field": "Semiconductors",
  "definition": "A suspension of abrasive particles in a liquid medium, used in chemical mechanical planarization (CMP) to polish and planarize semiconductor wafers. The slurry contains both abrasive particles, such as silica or alumina, and chemical agents that react with the wafer surface. The chemical and mechanical actions work synergistically to achieve material removal and surface flattening.",
  "subject": "Deposition, Etch & Clean",
  "url": "https://mlchart.com/terminology/semiconductors/slurry/"
}

Record 326 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.