MLchartDataset catalogue

Pad conditioning

Term · Semiconductors · MLC-T-SEM-000239

The process of restoring the surface texture and abrasive properties of a polishing pad used in chemical mechanical planarization (CMP). This is achieved by dragging a conditioning disk, often embedded with diamonds, across the pad surface during or between polishing cycles. Proper conditioning maintains a consistent removal rate and surface finish on the semiconductor wafer.

Table 1. Record
IdentifierMLC-T-SEM-000239
FieldSemiconductors
SubjectDeposition, Etch & Clean
Record as JSON 
{
  "id": "MLC-T-SEM-000239",
  "term": "Pad conditioning",
  "field": "Semiconductors",
  "definition": "The process of restoring the surface texture and abrasive properties of a polishing pad used in chemical mechanical planarization (CMP). This is achieved by dragging a conditioning disk, often embedded with diamonds, across the pad surface during or between polishing cycles. Proper conditioning maintains a consistent removal rate and surface finish on the semiconductor wafer.",
  "subject": "Deposition, Etch & Clean",
  "url": "https://mlchart.com/terminology/semiconductors/pad-conditioning/"
}

Record 246 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.