MLchartDataset catalogue

Megasonic cleaning

Term · Semiconductors · MLC-T-SEM-000213

A wafer cleaning method in which a liquid bath or spray is driven by acoustic waves of roughly 0.7 to 2 MHz, removing particles through acoustic streaming and the oscillation of small gas bubbles near the surface. The gentle bubble motion avoids the violent collapse that low-frequency ultrasonic cleaning at about 40 kHz produces, which can damage fine patterns, and it removes particles below one micrometer.

Table 1. Record
IdentifierMLC-T-SEM-000213
FieldSemiconductors
SubjectDeposition, Etch & Clean
Record as JSON 
{
  "id": "MLC-T-SEM-000213",
  "term": "Megasonic cleaning",
  "field": "Semiconductors",
  "definition": "A wafer cleaning method in which a liquid bath or spray is driven by acoustic waves of roughly 0.7 to 2 MHz, removing particles through acoustic streaming and the oscillation of small gas bubbles near the surface. The gentle bubble motion avoids the violent collapse that low-frequency ultrasonic cleaning at about 40 kHz produces, which can damage fine patterns, and it removes particles below one micrometer.",
  "subject": "Deposition, Etch & Clean",
  "url": "https://mlchart.com/terminology/semiconductors/megasonic-cleaning/"
}

Record 218 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.