Total thickness variation

{
  "id": "MLC-T-SEM-000339",
  "term": "Total thickness variation",
  "field": "Semiconductors",
  "definition": "The maximum difference between the highest and lowest points on the surface of a semiconductor wafer, relative to a reference plane. This measurement indicates the overall flatness and uniformity of the wafer's thickness. High TTV can cause issues during photolithography and other processing steps, with typical values for polished silicon wafers being less than 1 micrometer.",
  "abbreviation": "TTV",
  "subject": "Materials & Wafers",
  "url": "https://mlchart.com/terminology/semiconductors/total-thickness-variation/"
}