MLchartDataset catalogue

Warpage

Term · Semiconductors · MLC-T-SEM-000354

The out-of-plane deviation or bending of a semiconductor wafer, substrate, or package from a perfectly flat shape. This deformation is caused by thermal stresses resulting from the mismatch in the coefficient of thermal expansion between different materials, such as silicon and the package mold compound. Excessive warpage, measured in micrometers or millimeters, can cause handling issues during assembly and affect solder joint reliability.

Table 1. Record
IdentifierMLC-T-SEM-000354
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000354",
  "term": "Warpage",
  "field": "Semiconductors",
  "definition": "The out-of-plane deviation or bending of a semiconductor wafer, substrate, or package from a perfectly flat shape. This deformation is caused by thermal stresses resulting from the mismatch in the coefficient of thermal expansion between different materials, such as silicon and the package mold compound. Excessive warpage, measured in micrometers or millimeters, can cause handling issues during assembly and affect solder joint reliability.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/warpage/"
}

Record 374 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.