MLchartDataset catalogue

Die attach

Term · Semiconductors · MLC-T-SEM-000094

The process of physically mounting a semiconductor die onto a package substrate, lead frame, or another die. This step provides mechanical support and often facilitates thermal dissipation and electrical connection. Common methods include using epoxy adhesives, solder, or eutectic bonding, depending on the application requirements.

Table 1. Record
IdentifierMLC-T-SEM-000094
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000094",
  "term": "Die attach",
  "field": "Semiconductors",
  "definition": "The process of physically mounting a semiconductor die onto a package substrate, lead frame, or another die. This step provides mechanical support and often facilitates thermal dissipation and electrical connection. Common methods include using epoxy adhesives, solder, or eutectic bonding, depending on the application requirements.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/die-attach/"
}

Record 90 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.