MLchartDataset catalogue

Dicing

Term · Semiconductors · MLC-T-SEM-000093

The process of separating a semiconductor wafer into individual integrated circuits, or dies, after fabrication is complete. A high-precision dicing saw with a thin diamond blade cuts along scribe lines, which are non-functional streets between the dies. Alternative methods include laser dicing, which uses ablation to separate the dies, and plasma dicing for very thin wafers.

Table 1. Record
IdentifierMLC-T-SEM-000093
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000093",
  "term": "Dicing",
  "field": "Semiconductors",
  "definition": "The process of separating a semiconductor wafer into individual integrated circuits, or dies, after fabrication is complete. A high-precision dicing saw with a thin diamond blade cuts along scribe lines, which are non-functional streets between the dies. Alternative methods include laser dicing, which uses ablation to separate the dies, and plasma dicing for very thin wafers.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/dicing/"
}

Record 89 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.