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Physical vapour deposition

Term · Semiconductors · MLC-T-SEM-000249

A group of vacuum deposition techniques where a material is vaporized from a solid or liquid source and then deposited as a thin film onto a substrate. Common PVD methods include sputtering, evaporation, and pulsed laser deposition. These techniques are widely used for depositing metallic, dielectric, and protective coatings in semiconductor manufacturing.

Table 1. Record
IdentifierMLC-T-SEM-000249
FieldSemiconductors
SubjectDeposition, Etch & Clean
AbbreviationPVD
Record as JSON 
{
  "id": "MLC-T-SEM-000249",
  "term": "Physical vapour deposition",
  "field": "Semiconductors",
  "definition": "A group of vacuum deposition techniques where a material is vaporized from a solid or liquid source and then deposited as a thin film onto a substrate. Common PVD methods include sputtering, evaporation, and pulsed laser deposition. These techniques are widely used for depositing metallic, dielectric, and protective coatings in semiconductor manufacturing.",
  "abbreviation": "PVD",
  "subject": "Deposition, Etch & Clean",
  "url": "https://mlchart.com/terminology/semiconductors/physical-vapour-deposition/"
}

Record 258 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.