MLchartDataset catalogue

Seed layer

Term · Semiconductors · MLC-T-SEM-000300

A thin, conductive film deposited onto a substrate to provide a base for subsequent electroplating or electroless deposition of a thicker metal layer. It offers a uniform surface for nucleation and growth, promoting good adhesion and electrical continuity for the overlying material. Copper seed layers are widely used in damascene processes for interconnect formation.

Table 1. Record
IdentifierMLC-T-SEM-000300
FieldSemiconductors
SubjectFront-End Process
Record as JSON 
{
  "id": "MLC-T-SEM-000300",
  "term": "Seed layer",
  "field": "Semiconductors",
  "definition": "A thin, conductive film deposited onto a substrate to provide a base for subsequent electroplating or electroless deposition of a thicker metal layer. It offers a uniform surface for nucleation and growth, promoting good adhesion and electrical continuity for the overlying material. Copper seed layers are widely used in damascene processes for interconnect formation.",
  "subject": "Front-End Process",
  "url": "https://mlchart.com/terminology/semiconductors/seed-layer/"
}

Record 311 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.