MLchartDataset catalogue

Damascene

Term · Semiconductors · MLC-T-SEM-000080

A process technology used in semiconductor manufacturing to create copper interconnects by embedding the metal into trenches and vias etched into a dielectric layer. After deposition, excess metal is removed by chemical mechanical planarization, leaving only the desired conductive patterns. This method is preferred for copper due to its superior conductivity and electromigration resistance.

Table 1. Record
IdentifierMLC-T-SEM-000080
FieldSemiconductors
SubjectFront-End Process
Record as JSON 
{
  "id": "MLC-T-SEM-000080",
  "term": "Damascene",
  "field": "Semiconductors",
  "definition": "A process technology used in semiconductor manufacturing to create copper interconnects by embedding the metal into trenches and vias etched into a dielectric layer. After deposition, excess metal is removed by chemical mechanical planarization, leaving only the desired conductive patterns. This method is preferred for copper due to its superior conductivity and electromigration resistance.",
  "subject": "Front-End Process",
  "url": "https://mlchart.com/terminology/semiconductors/damascene/"
}

Record 75 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.