Via

{
  "id": "MLC-T-SEM-000345",
  "term": "Via",
  "field": "Semiconductors",
  "definition": "A vertical electrical connection that passes through one or more layers of insulating material to connect different conductive layers within a semiconductor device. These small, cylindrical openings are typically filled with a conductive metal, such as copper or tungsten, to establish interconnections between transistors and other circuit components. Vias are formed by etching through dielectric layers and then filling the resulting holes.",
  "subject": "Front-End Process",
  "url": "https://mlchart.com/terminology/semiconductors/via/"
}