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Back end of line

Term · Semiconductors · MLC-T-SEM-000034

The portion of semiconductor manufacturing that involves creating the interconnects between the individual transistors on a wafer. This includes depositing dielectric layers, etching vias and trenches, and filling them with conductive metals like copper or aluminum. BEOL processes occur after the active devices have been formed in the front end of line.

Table 1. Record
IdentifierMLC-T-SEM-000034
FieldSemiconductors
SubjectFront-End Process
AbbreviationBEOL
Record as JSON 
{
  "id": "MLC-T-SEM-000034",
  "term": "Back end of line",
  "field": "Semiconductors",
  "definition": "The portion of semiconductor manufacturing that involves creating the interconnects between the individual transistors on a wafer. This includes depositing dielectric layers, etching vias and trenches, and filling them with conductive metals like copper or aluminum. BEOL processes occur after the active devices have been formed in the front end of line.",
  "abbreviation": "BEOL",
  "subject": "Front-End Process",
  "url": "https://mlchart.com/terminology/semiconductors/back-end-of-line/"
}

Record 26 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.