MLchartDataset catalogue

Equipment front end module

Term · Semiconductors · MLC-T-SEM-000119

The part of a semiconductor processing tool responsible for loading and unloading wafers from standard wafer carriers, such as FOUPs (Front Opening Unified Pods), and transferring them to the internal processing modules. It operates in a cleanroom environment, maintaining the integrity of the wafer surface. The EFEM typically includes a robotic arm and a pre-aligner.

Table 1. Record
IdentifierMLC-T-SEM-000119
FieldSemiconductors
SubjectEquipment & Automation
AbbreviationEFEM
Record as JSON 
{
  "id": "MLC-T-SEM-000119",
  "term": "Equipment front end module",
  "field": "Semiconductors",
  "definition": "The part of a semiconductor processing tool responsible for loading and unloading wafers from standard wafer carriers, such as FOUPs (Front Opening Unified Pods), and transferring them to the internal processing modules. It operates in a cleanroom environment, maintaining the integrity of the wafer surface. The EFEM typically includes a robotic arm and a pre-aligner.",
  "abbreviation": "EFEM",
  "subject": "Equipment & Automation",
  "url": "https://mlchart.com/terminology/semiconductors/equipment-front-end-module/"
}

Record 116 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.