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Through-silicon via

Term · Semiconductors · MLC-T-SEM-000335

A vertical electrical connection that penetrates entirely through a silicon wafer or die, providing a path for electrical signals or power. These vias enable three-dimensional integration of semiconductor devices, allowing for shorter interconnects and higher packaging density. TSVs typically have diameters ranging from a few micrometers to tens of micrometers.

Table 1. Record
IdentifierMLC-T-SEM-000335
FieldSemiconductors
SubjectPackaging & ATMP
AbbreviationTSV
Record as JSON 
{
  "id": "MLC-T-SEM-000335",
  "term": "Through-silicon via",
  "field": "Semiconductors",
  "definition": "A vertical electrical connection that penetrates entirely through a silicon wafer or die, providing a path for electrical signals or power. These vias enable three-dimensional integration of semiconductor devices, allowing for shorter interconnects and higher packaging density. TSVs typically have diameters ranging from a few micrometers to tens of micrometers.",
  "abbreviation": "TSV",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/through-silicon-via/"
}

Record 352 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.