High bandwidth memory
Term · Semiconductors · MLC-T-SEM-000159
A type of high-performance random access memory interface that stacks multiple DRAM dies vertically on a base logic die, interconnected by through-silicon vias. This architecture provides significantly higher memory bandwidth and power efficiency compared to traditional planar memory designs. HBM is commonly used in applications requiring extensive memory bandwidth, such as graphics processing units and high-performance computing.
| Identifier | MLC-T-SEM-000159 |
|---|---|
| Field | Semiconductors |
| Subject | Packaging & ATMP |
| Abbreviation | HBM |
Record as JSON
{
"id": "MLC-T-SEM-000159",
"term": "High bandwidth memory",
"field": "Semiconductors",
"definition": "A type of high-performance random access memory interface that stacks multiple DRAM dies vertically on a base logic die, interconnected by through-silicon vias. This architecture provides significantly higher memory bandwidth and power efficiency compared to traditional planar memory designs. HBM is commonly used in applications requiring extensive memory bandwidth, such as graphics processing units and high-performance computing.",
"abbreviation": "HBM",
"subject": "Packaging & ATMP",
"url": "https://mlchart.com/terminology/semiconductors/high-bandwidth-memory/"
}
Record 160 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.