MLchartDataset catalogue

Chiplet

Term · Semiconductors · MLC-T-SEM-000059

A small, specialized integrated circuit die designed to be combined with other chiplets in a single package to form a larger, more complex system. This modular approach allows for mixing and matching dies from different manufacturing processes, such as logic, memory, and I/O, to create a customized system-in-package. The chiplets are interconnected using a high-speed die-to-die interconnect fabric on a shared substrate.

Table 1. Record
IdentifierMLC-T-SEM-000059
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000059",
  "term": "Chiplet",
  "field": "Semiconductors",
  "definition": "A small, specialized integrated circuit die designed to be combined with other chiplets in a single package to form a larger, more complex system. This modular approach allows for mixing and matching dies from different manufacturing processes, such as logic, memory, and I/O, to create a customized system-in-package. The chiplets are interconnected using a high-speed die-to-die interconnect fabric on a shared substrate.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/chiplet/"
}

Record 51 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.