Assembly, testing, marking and packaging

{
  "id": "MLC-T-SEM-000028",
  "term": "Assembly, testing, marking and packaging",
  "field": "Semiconductors",
  "definition": "The final sequence of manufacturing steps after wafer fabrication, collectively known as Assembly, testing, marking and packaging (ATMP). Assembly involves mounting the die onto a substrate, testing verifies its electrical performance, marking adds identifying codes, and packaging encapsulates the device for protection. These back-end processes transform individual dies from a wafer into finished, usable components ready for integration into electronic systems.",
  "abbreviation": "ATMP",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/assembly-testing-marking-and-packaging/"
}