MLchartDataset catalogue

Electroplating

Term · Semiconductors · MLC-T-SEM-000108

A process that uses an electric current to deposit a layer of metal onto a conductive surface. In semiconductor manufacturing, electroplating is primarily used to deposit copper for interconnects in the damascene process. The wafer acts as a cathode in an electrolytic bath, attracting metal ions to form a uniform film.

Table 1. Record
IdentifierMLC-T-SEM-000108
FieldSemiconductors
SubjectFront-End Process
Record as JSON 
{
  "id": "MLC-T-SEM-000108",
  "term": "Electroplating",
  "field": "Semiconductors",
  "definition": "A process that uses an electric current to deposit a layer of metal onto a conductive surface. In semiconductor manufacturing, electroplating is primarily used to deposit copper for interconnects in the damascene process. The wafer acts as a cathode in an electrolytic bath, attracting metal ions to form a uniform film.",
  "subject": "Front-End Process",
  "url": "https://mlchart.com/terminology/semiconductors/electroplating/"
}

Record 105 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.