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Electrostatic chuck

Term · Semiconductors · MLC-T-SEM-000109

A device used in semiconductor processing equipment to hold a wafer securely in place through electrostatic force. It consists of a dielectric layer sandwiched between two electrodes, which, when energized, create an electric field that clamps the wafer. This method provides uniform wafer clamping without mechanical contact, preventing particle generation and damage.

Table 1. Record
IdentifierMLC-T-SEM-000109
FieldSemiconductors
SubjectEquipment & Automation
AbbreviationESC
Record as JSON 
{
  "id": "MLC-T-SEM-000109",
  "term": "Electrostatic chuck",
  "field": "Semiconductors",
  "definition": "A device used in semiconductor processing equipment to hold a wafer securely in place through electrostatic force. It consists of a dielectric layer sandwiched between two electrodes, which, when energized, create an electric field that clamps the wafer. This method provides uniform wafer clamping without mechanical contact, preventing particle generation and damage.",
  "abbreviation": "ESC",
  "subject": "Equipment & Automation",
  "url": "https://mlchart.com/terminology/semiconductors/electrostatic-chuck/"
}

Record 106 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.