MLchartDataset catalogue

X-ray inspection

Term · Semiconductors · MLC-T-SEM-000366

A non-destructive imaging technique that uses X-rays to examine the internal structures of a packaged semiconductor device for defects that are not visible externally. It is used to detect issues such as wire bond shorts, opens, or sweep; die attach voids; and solder ball defects like bridging or voids in ball grid arrays. Two-dimensional (2D) systems provide a top-down view, while three-dimensional (3D) systems, using computed tomography, create a volumetric reconstruction of the package.

Table 1. Record
IdentifierMLC-T-SEM-000366
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000366",
  "term": "X-ray inspection",
  "field": "Semiconductors",
  "definition": "A non-destructive imaging technique that uses X-rays to examine the internal structures of a packaged semiconductor device for defects that are not visible externally. It is used to detect issues such as wire bond shorts, opens, or sweep; die attach voids; and solder ball defects like bridging or voids in ball grid arrays. Two-dimensional (2D) systems provide a top-down view, while three-dimensional (3D) systems, using computed tomography, create a volumetric reconstruction of the package.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/x-ray-inspection/"
}

Record 387 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.