MLchartDataset catalogue

Delamination

Term · Semiconductors · MLC-T-SEM-000087

The separation of layers within a semiconductor package or between the die and the package material. This defect can occur due to poor adhesion, thermal stress, or moisture ingress, leading to reliability issues such as cracking or electrical opens. It is often detected using acoustic microscopy during reliability testing.

Table 1. Record
IdentifierMLC-T-SEM-000087
FieldSemiconductors
SubjectPackaging & ATMP
Record as JSON 
{
  "id": "MLC-T-SEM-000087",
  "term": "Delamination",
  "field": "Semiconductors",
  "definition": "The separation of layers within a semiconductor package or between the die and the package material. This defect can occur due to poor adhesion, thermal stress, or moisture ingress, leading to reliability issues such as cracking or electrical opens. It is often detected using acoustic microscopy during reliability testing.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/delamination/"
}

Record 82 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.