Reflow

{
  "id": "MLC-T-SEM-000283",
  "term": "Reflow",
  "field": "Semiconductors",
  "definition": "A process in which solder paste, pre-applied to component pads on a substrate, is heated to a temperature sufficient to melt the solder alloy. This melting causes the solder to flow and create permanent electrical and mechanical connections between the component leads and the substrate pads upon cooling. The heating is performed in a reflow oven following a specific thermal profile that includes preheat, soak, reflow (peak temperature), and cooling stages to form a reliable solder joint.",
  "subject": "Packaging & ATMP",
  "url": "https://mlchart.com/terminology/semiconductors/reflow/"
}