Ball grid array

{
  "id": "MLC-T-IND-000398",
  "term": "Ball grid array",
  "field": "Industrial and trades",
  "definition": "A type of surface-mount package for integrated circuits that uses an array of solder balls on its underside for electrical connection to a printed circuit board. This packaging allows for a high number of interconnections in a compact area, improving signal integrity and thermal performance. BGAs are widely used for microprocessors and other complex chips.",
  "subject": "Industrial electronics",
  "translations": {
    "de": "Ball Grid Array",
    "es": "BGA",
    "fr": "BGA"
  },
  "url": "https://mlchart.com/terminology/industrial/ball-grid-array/"
}