Reballing

{
  "id": "MLC-T-IND-004713",
  "term": "Reballing",
  "field": "Industrial and trades",
  "definition": "The process of removing and replacing the solder balls on a ball grid array (BGA) package, typically performed to repair a faulty connection or to transfer a chip to a new board. This involves heating the chip to melt the existing solder, cleaning the pads, and then applying new solder balls using a stencil. Reballing is a common repair technique for electronic devices like game consoles and laptops.",
  "subject": "Energy and utilities",
  "translations": {
    "de": "Reballing",
    "es": "reballing",
    "fr": "reballing"
  },
  "url": "https://mlchart.com/terminology/industrial/reballing/"
}