Surface-mount technology

{
  "id": "MLC-T-IND-005785",
  "term": "Surface-mount technology",
  "field": "Industrial and trades",
  "definition": "A method for constructing electronic circuits by soldering components directly onto conductive pads on the face of a printed circuit board (PCB). Unlike through-hole technology, which passes component leads through the board, this technique keeps all connections on the surface. Surface-mount technology accommodates smaller components and higher circuit density, making it the dominant assembly method for mass-produced electronics.",
  "subject": "Industrial electronics",
  "translations": {
    "de": "Oberflächenmontage-Technologie",
    "es": "tecnología de montaje superficial",
    "fr": "technologie de montage en surface"
  },
  "url": "https://mlchart.com/terminology/industrial/surface-mount-technology/"
}