Surface-mount
Term · Industrial and trades · MLC-T-IND-005784
Describing an electronic assembly method where components are soldered directly onto the conductive pads of a printed circuit board. This technique eliminates the need for through-holes for component leads, allowing for higher component density and smaller board sizes. Surface-mount technology (SMT) is the predominant method for manufacturing modern electronic devices.
| Identifier | MLC-T-IND-005784 |
|---|---|
| Field | Industrial and trades |
| Subject | Industrial electronics |
| See also | Surface-mount technology |
| Translations | German: oberflächenmontierbar; Spanish: de montaje superficial; French: montage en surface |
Record as JSON
{
"id": "MLC-T-IND-005784",
"term": "Surface-mount",
"field": "Industrial and trades",
"definition": "Describing an electronic assembly method where components are soldered directly onto the conductive pads of a printed circuit board. This technique eliminates the need for through-holes for component leads, allowing for higher component density and smaller board sizes. Surface-mount technology (SMT) is the predominant method for manufacturing modern electronic devices.",
"subject": "Industrial electronics",
"see_also": [
"surface-mount technology"
],
"translations": {
"de": "oberflächenmontierbar",
"es": "de montaje superficial",
"fr": "montage en surface"
},
"url": "https://mlchart.com/terminology/industrial/surface-mount/"
}
Record 6,287 of 7,311 in Industrial and trades terminology (MLC-0113). Request the full dataset.