Through-hole technology

{
  "id": "MLC-T-IND-005983",
  "term": "Through-hole technology",
  "field": "Industrial and trades",
  "definition": "A method of assembling electronic components where component leads are inserted through holes drilled in a printed circuit board (PCB) and then soldered to pads on the opposite side. This technique provides strong mechanical bonds and is resistant to physical stress. While largely superseded by surface-mount technology for miniaturization, it remains common for large or high-power components.",
  "subject": "Industrial supplies, equipment, and components",
  "translations": {
    "de": "Through-Hole-Technik",
    "es": "tecnología de orificio pasante",
    "fr": "technologie traversante"
  },
  "url": "https://mlchart.com/terminology/industrial/through-hole-technology/"
}