Method for fabricating pattern using supporting assembly with rolling member disposed below supporting rods and semiconductor fabrication apparatus having the supporting assembly

{
  "publication_number": "US9857689B2",
  "country": "US",
  "kind": "B2",
  "title": "Method for fabricating pattern using supporting assembly with rolling member disposed below supporting rods and semiconductor fabrication apparatus having the supporting assembly",
  "abstract": "A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus including several tubes; (c) providing the supporting assembly to support the tubes, where the supporting assembly includes a first supporting rod having several first parallel recesses, a second supporting rod disposed opposite to the first supporting rod, a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member; (d) providing a photomask to the exposure apparatus; and (e) transferring the pattern from the photomask to the photosensitive layer.",
  "claims": [
    "1. A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus comprising a plurality of tubes; (c) providing a supporting assembly to support the tubes, wherein the supporting assembly comprises: a first supporting rod comprising a plurality of first parallel recesses, wherein the first parallel recesses are configured to receive the tubes; a second supporting rod disposed opposite to the first supporting rod; a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member; (d) providing a photomask to the exposure apparatus, wherein the photomask comprises a pattern; and (e) transferring the pattern from the photomask to the photosensitive layer.",
    "2. The method according to claim 1, wherein step (e) further comprises: providing a liquid to a surface of the photosensitive layer through the tubes; and moving the supporting assembly along a predetermined route.",
    "3. The method according to claim 1, wherein the tubes are received by the first parallel recesses.",
    "4. The method according to claim 1, wherein the rolling member directly contacts an underlying platform.",
    "5. The method according to claim 1, wherein the second supporting rod comprises a plurality of second parallel recesses.",
    "6. The method according to claim 1, wherein the rolling member is a rolling ball disposed directly below the first and second supporting rods.",
    "7. The method according to claim 6, wherein the rolling member is disposed directly below a longitudinal axis of the first and second supporting rods, the rolling member capable of moving the supporting assembly.",
    "8. A semiconductor fabrication apparatus disposed on a platform, comprising: an immersion exposure apparatus disposed on the platform, the immersion exposure apparatus comprising: a support plate; a projection optical lens disposed above the support plate; and a plurality of tubes, wherein one end of each of the tubes is disposed between the support plate and the projection optical lens and the other end of each of the tubes extends out of the immersion exposure apparatus; and a supporting assembly disposed on the platform, wherein the supporting assembly comprises: a first supporting rod comprising a plurality of first parallel recesses, wherein the first parallel recesses are configured to receive the tubes; a second supporting rod disposed opposite to the first supporting rod; a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member.",
    "9. The semiconductor fabrication apparatus according to claim 8, wherein the second supporting rod comprises a plurality of second parallel recesses.",
    "10. The semiconductor fabrication apparatus according to claim 8, wherein the rolling member is a rolling ball disposed directly below the first and second supporting rods.",
    "11. The semiconductor fabrication apparatus according to claim 10, wherein the rolling member is disposed directly below a longitudinal axis of the first and second supporting rods, the rolling member capable of moving the supporting assembly."
  ],
  "description_excerpt": "1. Field of the Invention\n\nThe present invention generally relates to the field of a supporting apparatus, and more particularly to a method of fabricating a pattern using a supporting assembly and a fabrication apparatus including the supporting assembly.\n\n2. Description of the Prior Art\n\nWith the increasing miniaturization of semiconductor devices, a variety of projection exposure apparatuses used to transfer patterns from a reticle to a substrate have been invented. Currently, in order to improve both the resolutions and the depth of the focus (DOF), immersion exposure apparatuses have been developed and are widely adopted by the semiconductor manufactures.\n\nBriefly, the basic working principle of the immersion exposure apparatus is that the space between an objective lens and a photosensitive layer can be filled with high-index liquid during an exposure process. By the use of high-index liquid, the light passing through the objective lens may be further concentrated before it reaches the surface of the photosensitive layer. In this way, the dimensions of patterns formed in the photosensitive layer may be decreased effectively without reducing the depth of the focus.\n\nFurthermore, in order to apply high-index liquid to the space between the objective lens and the photosensitive layer, a liquid supply apparatus including several flexible tubes is often equipped in the immersion exposure apparatus. The flexible tubes are often indirect contact with an underlying platform and are used to transport liquid from containers to the immersion exposure apparatus.",
  "cpc": [
    "G03F 7/2041",
    "F16L 3/01",
    "F16L 3/10",
    "F16L 3/2235",
    "G03F 7/70341",
    "G03F 7/70816",
    "G03F 7/70825",
    "G03F 7/709",
    "H01L 21/0335",
    "H01L 21/0337",
    "H01L 21/0338",
    "H01L 21/3086",
    "H10P 50/695",
    "H10P 76/4083",
    "H10P 76/4085",
    "H10P 76/4088"
  ],
  "ipc": [
    "G03F 7/20",
    "H10P 76/40",
    "F16L 3/01",
    "F16L 3/10",
    "F16L 3/223",
    "G03B 27/54",
    "G03B 27/58",
    "G03B 27/62",
    "H02K 41/02"
  ],
  "assignees": [
    "United Microelectronics Corp"
  ],
  "inventors": [
    "Chien-Ju Wu",
    "Ming-Sung Wu"
  ],
  "filing_date": "2016-06-22",
  "publication_date": "2018-01-02",
  "grant_date": "2018-01-02",
  "priority_date": "2013-12-23",
  "application_number": "US-201615190165-A",
  "family_id": "53399559",
  "cited_by_count": 3,
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}