MLchartDataset catalogue

Process integration

Term · Semiconductors · MLC-T-SEM-000267

The discipline of combining and sequencing individual fabrication steps, such as deposition, lithography, and etch, into a coherent and manufacturable process flow for creating a semiconductor device. It involves managing the interactions between different process modules to meet performance, yield, and reliability targets. A key challenge is managing the thermal budget, which is the total amount of time and temperature a wafer is exposed to during manufacturing, as excessive heat can degrade device structures.

Table 1. Record
IdentifierMLC-T-SEM-000267
FieldSemiconductors
SubjectFront-End Process
Record as JSON 
{
  "id": "MLC-T-SEM-000267",
  "term": "Process integration",
  "field": "Semiconductors",
  "definition": "The discipline of combining and sequencing individual fabrication steps, such as deposition, lithography, and etch, into a coherent and manufacturable process flow for creating a semiconductor device. It involves managing the interactions between different process modules to meet performance, yield, and reliability targets. A key challenge is managing the thermal budget, which is the total amount of time and temperature a wafer is exposed to during manufacturing, as excessive heat can degrade device structures.",
  "subject": "Front-End Process",
  "url": "https://mlchart.com/terminology/semiconductors/process-integration/"
}

Record 276 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.