MLchartDataset catalogue

Thermal budget

Term · Semiconductors · MLC-T-SEM-000332

The cumulative amount of thermal energy a wafer is exposed to throughout the entire manufacturing sequence, quantified by the combination of temperature and time for all high-temperature steps. Excessive thermal budget can cause unwanted dopant diffusion, altering the precisely engineered electrical properties of transistors and other components. It is expressed as the integral of temperature over time for processes like annealing, oxidation, and deposition.

Table 1. Record
IdentifierMLC-T-SEM-000332
FieldSemiconductors
SubjectFront-End Process
Record as JSON 
{
  "id": "MLC-T-SEM-000332",
  "term": "Thermal budget",
  "field": "Semiconductors",
  "definition": "The cumulative amount of thermal energy a wafer is exposed to throughout the entire manufacturing sequence, quantified by the combination of temperature and time for all high-temperature steps. Excessive thermal budget can cause unwanted dopant diffusion, altering the precisely engineered electrical properties of transistors and other components. It is expressed as the integral of temperature over time for processes like annealing, oxidation, and deposition.",
  "subject": "Front-End Process",
  "url": "https://mlchart.com/terminology/semiconductors/thermal-budget/"
}

Record 348 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.