Stoichiometric sputtering

{
  "id": "MLC-T-CHM-011433",
  "term": "Stoichiometric sputtering",
  "field": "Chemistry",
  "definition": "The process where the composition of the sputtered material from a target surface is identical to the bulk composition of the target itself. This occurs when the sputtering yields of all constituent elements are proportional to their concentrations in the target. Achieving stoichiometric sputtering is often desired in thin film deposition to maintain the desired material properties.",
  "subject": "Analytical Chemistry",
  "see_also": [
    "steady-state sputtering"
  ],
  "references": [
    "PAC, 2020, 92, 1781. 'Glossary of methods and terms used in surface chemical analysis (IUPAC Recommendations 2020)' on page 1815 (https://doi.org/10.1515/pac-2019-0404)"
  ],
  "url": "https://mlchart.com/terminology/chemistry/stoichiometric-sputtering/"
}