MLchartDataset catalogue

LGA

Term · Computing and IT · MLC-T-CMP-000678

A type of surface-mount packaging for integrated circuits, particularly microprocessors. It features a grid of flat contacts (lands) on the underside of the chip package that mate with spring-loaded pins on the motherboard socket. This design reduces the risk of bent pins on the processor itself, as the pins are on the socket.

Table 1. Record
IdentifierMLC-T-CMP-000678
FieldComputing and IT
SubjectTechnical
Record as JSON 
{
  "id": "MLC-T-CMP-000678",
  "term": "LGA",
  "field": "Computing and IT",
  "definition": "A type of surface-mount packaging for integrated circuits, particularly microprocessors. It features a grid of flat contacts (lands) on the underside of the chip package that mate with spring-loaded pins on the motherboard socket. This design reduces the risk of bent pins on the processor itself, as the pins are on the socket.",
  "subject": "Technical",
  "url": "https://mlchart.com/terminology/computing/lga/"
}

Record 745 of 1,553 in Computing and IT terminology (MLC-0101). Request the full dataset.