MLchartDataset catalogue

Process Type

Term · Environment · MLC-T-ENV-022301

Broad groups of manufacturing steps used at a facility associated with substrate (e.g., wafer) processing during device manufacture for which fluorinated GHG emissions and fluorinated GHG usages are calculated and reported. The process types are Plasma etching, Chamber cleaning, and Wafer cleaning.

Table 1. Record
IdentifierMLC-T-ENV-022301
FieldEnvironment
References40 CFR 98.98 (CFR 2013)
Record as JSON 
{
  "id": "MLC-T-ENV-022301",
  "term": "Process Type",
  "field": "Environment",
  "definition": "Broad groups of manufacturing steps used at a facility associated with substrate (e.g., wafer) processing during device manufacture for which fluorinated GHG emissions and fluorinated GHG usages are calculated and reported. The process types are Plasma etching, Chamber cleaning, and Wafer cleaning.",
  "references": [
    "40 CFR 98.98 (CFR 2013)"
  ],
  "url": "https://mlchart.com/terminology/environment/process-type/"
}

Record 22,301 of 30,736 in Environment terminology (MLC-0121). Request the full dataset.