Post-apply bake
Term · Chemistry · MLC-T-CHM-009301
A thermal step carried out on a resist film right after it is spin-coated onto a substrate and before exposure, also called the soft bake. It drives off most of the casting solvent, which anneals the film, raises its density and improves adhesion to the substrate. It is distinct from the post-exposure bake, which follows exposure and is the step that smooths standing-wave patterns.
| Identifier | MLC-T-CHM-009301 |
|---|---|
| Field | Chemistry |
| Subject | Polymer |
| References | PAC, 2020, 92, 1861. 'Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)' on page 1885 (https://doi.org/10.1515/pac-2018-1215) |
| See also | Annealing; Resist |
Record as JSON
{
"id": "MLC-T-CHM-009301",
"term": "Post-apply bake",
"field": "Chemistry",
"definition": "A thermal step carried out on a resist film right after it is spin-coated onto a substrate and before exposure, also called the soft bake. It drives off most of the casting solvent, which anneals the film, raises its density and improves adhesion to the substrate. It is distinct from the post-exposure bake, which follows exposure and is the step that smooths standing-wave patterns.",
"subject": "Polymer",
"see_also": [
"annealing",
"resist"
],
"references": [
"PAC, 2020, 92, 1861. 'Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)' on page 1885 (https://doi.org/10.1515/pac-2018-1215)"
],
"url": "https://mlchart.com/terminology/chemistry/post-apply-bake/"
}
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