Tombstoning

{
  "id": "MLC-T-IND-006054",
  "term": "Tombstoning",
  "field": "Industrial and trades",
  "definition": "A soldering defect in surface-mount technology (SMT) where a component stands on one end, resembling a tombstone, rather than lying flat on the printed circuit board. This occurs when the solder paste on one pad melts and wets before the other, pulling the component upright due to surface tension. It is often caused by uneven heating or improper pad design during reflow soldering.",
  "synonyms": [
    "tombstone effect",
    "drawbridging",
    "Manhattan effect"
  ],
  "subject": "Industrial electronics",
  "translations": {
    "de": "Tombstoning",
    "es": "efecto lápida",
    "fr": "effet pierre tombale"
  },
  "url": "https://mlchart.com/terminology/industrial/tombstoning/"
}