MLchartDataset catalogue

Wafer probe

Term · Semiconductors · MLC-T-SEM-000352

The process of electrically testing individual semiconductor die while they are still part of the intact wafer, before being separated and packaged. A probe card makes contact with the test pads on each die, and automated test equipment performs a series of electrical measurements. This step identifies defective die early in the manufacturing flow, reducing overall production costs.

Table 1. Record
IdentifierMLC-T-SEM-000352
FieldSemiconductors
SubjectTest & Reliability
Record as JSON 
{
  "id": "MLC-T-SEM-000352",
  "term": "Wafer probe",
  "field": "Semiconductors",
  "definition": "The process of electrically testing individual semiconductor die while they are still part of the intact wafer, before being separated and packaged. A probe card makes contact with the test pads on each die, and automated test equipment performs a series of electrical measurements. This step identifies defective die early in the manufacturing flow, reducing overall production costs.",
  "subject": "Test & Reliability",
  "url": "https://mlchart.com/terminology/semiconductors/wafer-probe/"
}

Record 371 of 390 in Semiconductors terminology (MLC-0108). Request the full dataset.