Patents full text · MLC-0201
CPC subclass H10P
Generic processes or apparatus for the manufacture or treatment of devices covered by class H10
| No. | Publication | Title | Published | Assignee |
|---|---|---|---|---|
| 1 | US12452706B2 | Article transport facility | 2025-10-21 | Daifuku Co Ltd |
| 2 | US12441374B2 | OHT vehicle traction device and method for recoverying malfunctioned vehicle | 2025-10-14 | Semes Co Ltd |
| 3 | US12300532B2 | Wafer frame sorter and stocker | 2025-05-13 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 4 | US12278133B2 | Substrate transferring unit, substrate processing apparatus, and substrate processing method | 2025-04-15 | Samsung Electronics Co Ltd |
| 5 | US12261067B2 | Wafer cleaning apparatus and wafer transfer device | 2025-03-25 | Beijing Naura Microelectronics Equipment Co Ltd |
| 6 | US12237197B2 | Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current | 2025-02-25 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 7 | US12198957B2 | Communication method, transport system, and communication device | 2025-01-14 | Murata Machinery Ltd |
| 8 | US12191180B2 | Overhead buffer double-entry detection system and method thereof | 2025-01-07 | Changxin Memory Technologies Inc |
| 9 | US12153433B2 | Systems and methods for raised floor automated sensor vehicles | 2024-11-26 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 10 | US12148643B2 | Carrier vehicle system | 2024-11-19 | Murata Machinery Ltd |
| 11 | US12131937B2 | Transfer system, transfer device, and transfer method | 2024-10-29 | Tokyo Electron Ltd |
| 12 | US12106991B2 | Substrate transfer systems and methods of use thereof | 2024-10-01 | Applied Materials Inc |
| 13 | US12103787B2 | Method and device for transferring components | 2024-10-01 | EV Group E Thallner GmbH |
| 14 | US12103176B2 | Linear robot with two-link arm | 2024-10-01 | Persimmon Technologies Corp |
| 15 | US12091063B2 | Damping device, stacker crane, transport system, and damping device jig | 2024-09-17 | Murata Machinery Ltd |
| 16 | US12080581B2 | Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current | 2024-09-03 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 17 | US12068182B2 | Device for recognizing wafer identification number with automatically turning on and off recognizing function | 2024-08-20 | National Tsing Hua University NTHU |
| 18 | US12024769B2 | Movable work piece carrier device for holding work pieces to be treated | 2024-07-02 | Oerlikon Surface Solutions AG Pfaeffikon |
| 19 | US12004337B2 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools | 2024-06-04 | Applied Materials Inc |
| 20 | US11978678B2 | Display device | 2024-05-07 | Innolux Corp |
| 21 | US11978654B2 | Substrate processing apparatus | 2024-05-07 | Semes Co Ltd |
| 22 | US2024057464A1 | Manufacturing equipment for light-emitting device | 2024-02-15 | Semiconductor Energy Laboratory Co Ltd |
| 23 | US11830749B2 | Substrate transport apparatus | 2023-11-28 | Brooks Automation US LLC |
| 24 | US11810801B2 | Robot embedded vision apparatus | 2023-11-07 | Brooks Automation US LLC |
| 25 | US11728306B2 | Selective micro device transfer to receiver substrate | 2023-08-15 | Vuereal Inc |
| 26 | US11688589B2 | Carrier with vertical grid for supporting substrates in coater | 2023-06-27 | View Inc |
| 27 | US11676840B2 | Adsorption device, transferring system having same, and transferring method using same | 2023-06-13 | Century Technology Shenzhen Corp Ltd |
| 28 | US11664258B2 | Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current | 2023-05-30 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 29 | US11600198B2 | System for dynamically provisioning cyber training environments | 2023-03-07 | Circadence Corp |
| 30 | US11515188B2 | Wafer boat handling device, vertical batch furnace and method | 2022-11-29 | ASM IP Holding BV |
| 31 | US11498779B2 | Adsorption device, method for making same, and transferring system having same | 2022-11-15 | Century Technology Shenzhen Corp Ltd |
| 32 | US2022344182A1 | Transfer chamber | 2022-10-27 | Sinfonia Technology Co Ltd |
| 33 | US11469132B2 | Method of aligning micro light emitting element and display transferring structure | 2022-10-11 | Samsung Electronics Co Ltd |
| 34 | US11446762B2 | Laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device | 2022-09-20 | JSW Aktina System Co Ltd |
| 35 | US11442440B1 | Method and apparatus of handling control wafer, method of testing by using control wafer | 2022-09-13 | Changxin Memory Technologies Inc |
| 36 | US11430683B2 | Conveying device for conveying at least one wafer | 2022-08-30 | Robert Bosch GmbH |
| 37 | US11400495B2 | Automated particle removal system having angular adjustability | 2022-08-02 | ASM Technology Singapore Pte Ltd |
| 38 | US11396082B2 | Substrate holding device and substrate processing apparatus including the same | 2022-07-26 | Ebara Corp |
| 39 | US11390525B2 | Carbon nanotube aggregate comprising a non-aligned portion | 2022-07-19 | Nitto Denko Corp |
| 40 | US11335828B2 | Method of handling micro device | 2022-05-17 | Mikro Mesa Technology Co Ltd |
| 41 | US11328946B2 | Manufacturing method of ESD protection device | 2022-05-10 | Industrial Technology Research Institute ITRI |
| 42 | US11309168B2 | Vacuum processing apparatus and maintenance apparatus | 2022-04-19 | Tokyo Electron Ltd |
| 43 | US11295971B2 | Adsorption device comprising a magnetic plate having opposite magnetic poles, transferring system having same | 2022-04-05 | Century Technology Shenzhen Corp Ltd |
| 44 | US11292637B1 | Central support device for supporting plate-shaped object and storage apparatus for storing plate-shaped object | 2022-04-05 | Gudeng Precision Industrial Co Ltd |
| 45 | US11235935B2 | Substrate transport apparatus | 2022-02-01 | Brooks Automation Inc |
| 46 | US2022020575A1 | Apparatus for treating substrate, method for measuring height difference between lift pins, and computer readable recording medium having processing program stored therein | 2022-01-20 | Semes Co Ltd |
| 47 | US11223014B2 | Semiconductor structures including liners comprising alucone and related methods | 2022-01-11 | Micron Technology Inc |
| 48 | US2022005736A1 | Substrate processing apparatus and substrate processing method | 2022-01-06 | Screen Holdings Co Ltd |
| 49 | US11171098B2 | Package and manufacturing method thereof | 2021-11-09 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 50 | US11158079B2 | Substrate treating apparatus and apparatus and method for eccentricity inspection | 2021-10-26 | Semes Co Ltd |
| 51 | US11139187B2 | Adsorption device and transferring system having same | 2021-10-05 | Century Technology Shenzhen Corp Ltd |
| 52 | US11133453B2 | Piezoelectric driving device, piezoelectric motor, robot, electronic-component conveying apparatus, printer, and projector | 2021-09-28 | Seiko Epson Corp |
| 53 | US11091397B2 | Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices | 2021-08-17 | Watlow Electric Manufacturing Co |
| 54 | US11088182B2 | Method for transferring light emitting elements, display panel, method for making display panel, and substrate | 2021-08-10 | Century Technology Shenzhen Corp Ltd |
| 55 | US11043404B2 | Method for PUF generation using variations in transistor threshold voltage and subthreshold leakage current | 2021-06-22 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 56 | US11024531B2 | Optimized low energy / high productivity deposition system | 2021-06-01 | Lam Research Corp |
| 57 | US10964582B2 | Transfer substrate utilizing selectable surface adhesion transfer elements | 2021-03-30 | Palo Alto Research Center Inc |
| 58 | US10937768B2 | Method of manufacturing display device | 2021-03-02 | Seoul Semiconductor Co Ltd |
| 59 | US10930494B2 | Vapor phase transport system and method for depositing perovskite semiconductors | 2021-02-23 | Swift Solar Inc |
| 60 | US10923370B2 | Transport system and transport method | 2021-02-16 | Murata Machinery Ltd |
| 61 | US10872801B2 | Target substrate with micro semiconductor structures | 2020-12-22 | Ultra Display Technology Corp |
| 62 | US10825702B2 | Method and device for self-assembling semiconductor light-emitting diodes | 2020-11-03 | LG Electronics Inc |
| 63 | US10794681B2 | Long range capacitive gap measurement in a wafer form sensor system | 2020-10-06 | Applied Materials Inc |
| 64 | US10777446B2 | Mounting member | 2020-09-15 | Nitto Denko Corp |
| 65 | US10734497B2 | Methods for forming a semiconductor device structure and related semiconductor device structures | 2020-08-04 | ASM IP Holding BV |
| 66 | US10707652B1 | Vacuum fixture | 2020-07-07 | Waymo LLC |
| 67 | US10699878B2 | Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring | 2020-06-30 | Lam Research Corp |
| 68 | US10685832B1 | Substrate processing apparatus | 2020-06-16 | Kokusai Electric Corp |
| 69 | US2020111690A1 | Substrate processing apparatus and method | 2020-04-09 | ASM IP Holding BV |
| 70 | US10593571B2 | Substrate processing apparatus | 2020-03-17 | Tokyo Electron Ltd |
| 71 | US10529585B2 | Dry stripping of boron carbide hardmask | 2020-01-07 | Applied Materials Inc |
| 72 | US10510871B1 | Semiconductor device and method | 2019-12-17 | Taiwan Semiconductor Manufacturing Co TSMC Ltd |
| 73 | US10505070B2 | Micro device transfer equipment and related method | 2019-12-10 | Acer Inc |
| 74 | US10497596B2 | Overhead manufacturing, processing and storage system | 2019-12-03 | Murata Machinery Ltd |
| 75 | US10446424B2 | Storage device and photoresist coating and developing machine having storage device | 2019-10-15 | BOE Technology Group Co Ltd |
| 76 | US10410943B2 | Method for passivating a surface of a semiconductor and related systems | 2019-09-10 | ASM IP Holding BV |
| 77 | US10403531B2 | Semiconductor manufacturing apparatus with supporting columns and tables | 2019-09-03 | Toshiba Memory Corp |
| 78 | US10395960B2 | High density stocker with interlocking nubs | 2019-08-27 | Murata Machinery Ltd |
| 79 | US10367080B2 | Method of forming a germanium oxynitride film | 2019-07-30 | ASM IP Holding BV |
| 80 | US10347470B2 | Process chamber and semiconductor processing apparatus | 2019-07-09 | Beijing Naura Microelectronics Equipment Co Ltd |
| 81 | US10338472B2 | Mark forming method and device manufacturing method | 2019-07-02 | Nikon Corp |
| 82 | US10332747B1 | Selective titanium nitride deposition using oxides of lanthanum masks | 2019-06-25 | GlobalFoundries Inc |
| 83 | US10304940B1 | Gate cut and fin trim isolation for advanced integrated circuit structure fabrication | 2019-05-28 | Intel Corp |
| 84 | US10290508B1 | Method for forming vertical spacers for spacer-defined patterning | 2019-05-14 | ASM IP Holding BV |
| 85 | US10283353B2 | Method of reforming insulating film deposited on substrate with recess pattern | 2019-05-07 | ASM IP Holding BV |
| 86 | US10269604B2 | Substrate transport vacuum platform | 2019-04-23 | Persimmon Technologies Corp |
| 87 | US10236259B2 | Mark, method for forming same, and exposure apparatus | 2019-03-19 | Nikon Corp |
| 88 | US10236197B2 | Processing system containing an isolation region separating a deposition chamber from a treatment chamber | 2019-03-19 | Applied Materials Inc |
| 89 | US10229985B1 | Vertical field-effect transistor with uniform bottom spacer | 2019-03-12 | International Business Machines Corp |
| 90 | US10217678B2 | Display device and method of manufacturing the display device | 2019-02-26 | Innolux Corp |
| 91 | US10211308B2 | NbMC layers | 2019-02-19 | ASM IP Holding BV |
| 92 | US10211055B2 | Fin patterns with varying spacing without fin cut | 2019-02-19 | International Business Machines Corp |
| 93 | US10204788B1 | Method of forming high dielectric constant dielectric layer by atomic layer deposition | 2019-02-12 | United Microelectronics Corp |
| 94 | US10197617B2 | Probe card loading apparatus and probe card managing system including the same | 2019-02-05 | Samsung Electronics Co Ltd |
| 95 | US10192734B2 | Short inorganic trisilylamine-based polysilazanes for thin film deposition | 2019-01-29 | LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude |
| 96 | US10189243B2 | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion | 2019-01-29 | X Celeprint Ltd |
| 97 | US10186449B2 | Apparatus and methods for wafer rotation to improve spatial ALD process uniformity | 2019-01-22 | Applied Materials Inc |
| 98 | US10181483B2 | Laser assisted transfer welding process | 2019-01-15 | X Celeprint Ltd |
| 99 | US10170893B1 | Vacuum fixture | 2019-01-01 | Waymo LLC |
| 100 | US10163869B2 | Transferring method, manufacturing method, device and electronic apparatus of micro-LED | 2018-12-25 | Goertek Inc |
264 records in this listing. Patents full text (MLC-0201). Request the full dataset.