| ADC | Automatic defect classification |
| AFM | Atomic force microscope |
| AMC | Airborne molecular contamination |
| AMHS | Automated material handling system |
| APC | Advanced process control |
| a-Si | Amorphous silicon |
| ASIC | Application-specific integrated circuit |
| ASP | Average selling price |
| ATE | Automated test equipment |
| ATMP | Assembly, testing, marking and packaging |
| BEOL | Back end of line |
| BGA | Ball grid array |
| BIST | Built-in self-test |
| CD | Critical dimension |
| CDA | Clean dry air |
| C-DAC | Centre for Development of Advanced Computing |
| CD-SEM | Critical dimension scanning electron microscope |
| CIM | Computer-integrated manufacturing |
| CIS | CMOS image sensor |
| CMOS | Complementary MOS |
| CMP | Chemical mechanical planarisation |
| CSP | Chip-scale package |
| CVD | Chemical vapour deposition |
| CZ | Czochralski growth |
| DFT | Design for test |
| DLI | Design linked incentive |
| DoF | Depth of focus |
| DRAM | Dynamic random-access memory |
| DRC | Design rule check |
| DUV | Deep ultraviolet |
| EDA | Electronic design automation |
| EFEM | Equipment front end module |
| EHS | Environment, health and safety |
| EM | Electromigration |
| EMO | Emergency off |
| Epi | Epitaxy |
| ESC | Electrostatic chuck |
| ESD | Electrostatic discharge |
| ESG | Environmental, social and governance |
| ESSCI | Electronics Sector Skills Council of India |
| EUV | Extreme ultraviolet lithography |
| FAT | Factory acceptance test |
| FDC | Fault detection and classification |
| FEOL | Front end of line |
| FFU | Fan filter unit |
| FIB | Focused ion beam |
| FIT | Failures in time |
| FMEA | Failure mode and effects analysis |
| FOUP | Front opening unified pod |
| FOWLP | Fan-out |
| FPGA | Field-programmable gate array |
| FZ | Float zone |
| GAA | Gate all around |
| GaAs | Gallium arsenide |
| GaN | Gallium nitride |
| GWP | Global warming potential |
| HBM | High bandwidth memory |
| HEPA | High Efficiency Particulate Air filter |
| HF | Hydrofluoric acid |
| HITL | Human in the loop |
| HKMG | High-k Metal Gate |
| HTOL | High-temperature operating life |
| HVAC | Heating, ventilation and air conditioning |
| HVM | High volume manufacturing |
| IC | Integrated circuit |
| IDM | Integrated device manufacturer |
| IESA | India Electronics and Semiconductor Association |
| InP | Indium phosphide |
| IRDS | International Roadmap for Devices and Systems |
| ISM | India Semiconductor Mission |
| KGD | Known good die |
| LCA | Life-cycle assessment |
| LER | Line edge roughness |
| LPCVD | Low pressure CVD |
| LVS | Layout versus schematic |
| MeitY | Ministry of Electronics and Information Technology |
| MEMS | Micro electro mechanical systems |
| MES | Manufacturing execution system |
| MFC | Mass flow controller |
| ML | Machine learning |
| MOL | Middle of line |
| MOSFET | Metal oxide semiconductor field effect transistor |
| MSL | Moisture sensitivity level |
| MTBF | Mean time between failures |
| NA | Numerical aperture |
| NBTI | Negative-bias temperature instability |
| NEP 2020 | National Education Policy 2020 |
| OEE | Overall equipment effectiveness |
| OHT | Overhead hoist transport |
| OPC | Optical proximity correction |
| OSAT | Outsourced semiconductor assembly and test |
| PCW | Process cooling water |
| PDK | Process design kit |
| PEB | Post exposure bake |
| PECVD | Plasma enhanced CVD |
| PFC | Perfluorinated compounds |
| PLI | Production linked incentive |
| PM | Preventive maintenance |
| Poly | Polysilicon |
| POU | Point of use abatement |
| PPA | Power purchase agreement |
| PPE | Personal protective equipment |
| PPM | Parts per million |
| P&R | Place and route |
| PSM | Phase shift mask |
| PVD | Physical vapour deposition |
| QFN | Quad Flat No-lead |
| Qual | Qualification |
| R2R | Run to run control |
| RIE | Reactive ion etch |
| RTA | Rapid thermal anneal |
| RTL | Register-transfer level |
| SCL | Semi-Conductor Laboratory |
| SEM | Scanning electron microscope |
| Si | Silicon |
| SiC | Silicon carbide |
| SiP | System in package |
| SMIF | Standard mechanical interface |
| SoC | System on chip |
| SOI | Silicon on insulator |
| SPC | Statistical process control |
| SRAM | Static random-access memory |
| STI | Shallow trench isolation |
| TDDB | Time dependent dielectric breakdown |
| TEM | Transmission electron microscope |
| TGM | Toxic gas monitoring |
| TSV | Through-silicon via |
| TTV | Total thickness variation |
| Turbo | Turbomolecular pump |
| UPW | Ultrapure water |
| WIP | Work in progress |
| WLP | Wafer-level packaging |
| WSPM | Wafer starts per month |
| XRD | X-ray diffraction |
| XRF | X-ray fluorescence |
| ZLD | Zero liquid discharge |